Publications

[90] “Total internal reflection optical switch using reverse breakdown of pn junction in silicon”, Jong-Hun Kim and Hyo-Hoon Park, Optics Lett., vol. 40, no. 21, November 2015.

[89] “Tunable grating couplers for broadband operation using thermo-optic effect in silicon” Jong-Hun Kim, Ji-Hwan Park, Sun-Kyu Han, Min-Jung Bae, Dong-Eun Yoo, Dong-Wook Lee, and Hyo-Hoon Park, IEEE Photon. Tech. Lett., vol. 27, no. 21, November 2015.

[88] “Power saving Rx design for optical modules”, Jamshid Sangirov, Ikechi Augustine Ukaegbu, Nguyen T. H. Nga, Tae-Woo Lee, Mu-Hee Cho, and Hyo-Hoon Park, Journal of Circuits, Systems, and Computers, vol. 24, no. 7, May 2015.

[87] “10 Gbps/ch full-duplex optical link using a single-fiber channel for signal transmission”, Nguyen T. H. Nga, Gwan-Chong Joo, Byueng-Su Yoo, Ikechi Augustine Ukaegbu, Jamshid Sangirov, Mu-Hee Cho, Tae-Woo Lee, and Hyo-Hoon Park, IEEE Photon. Tech. Lett., vol. 26, no. 6, pp.609-611, March 2014.

[86] “40 Gb/s optical subassembly module for a multi-channel bidirectional optical link”, Jamshid Sangirov, Gwan-Chong Joo, Byueng-Su Yoo, Ikechi Augustine Ukaegbu, Nguyen T. H. Nga, Tae-Woo Lee, Mu-Hee Cho, and Hyo-Hoon Park, Optics Express, vol.22, no.2, pp.1768-1783, Jan. 2014.

[85] “Bi-wavelength transceiver module for parallel-simultaneous bidirectional optical interconnects”, Nguyen T. H. Nga, Ikechi Augustine Ukaegbu, Jamshid Sangirov, Mu-Hee Cho, Tae-Woo Lee, and Hyo-Hoon Park, J. Optical Engineering, vol.52, no.12, p.120502, Dec. 2013.

[84] “Power-aware transceiver design for half-duplex bidirectional chip-to-chip optical interconnects”, Jamshid Sangirov, Ikechi Augustine Ukaegbu, Tae-Woo Lee, and Hyo-Hoon Park, J. of Semiconductors, vol.34, no.12, p.125001, Dec. 2013.

[83] “Design of small-area transimpedance optical receiver module for optical interconnects”, Jamshid Sangirov, Ikechi Augustine Ukaegbu, Nga T. H. Nguyen, Tae-Woo Lee, Mu Hee Cho, and Hyo-Hoon Park,  ICACT Trans. on Advanced Communications Tech., vol.2, iss.4, pp.283-289, July 2013.

[82] “0.013 mm2 and low-power 10 Gb/s transimpedance amplifier (TIA) for short-reach optical interconnects”, Nga T. H. Nguyen, Tae-Woo Lee, and Hyo-Hoon Park, IEEE Microwave and Optical Technology Letters, vol.55, no.10, pp.2484-2487, Oct.  2013.

[81] “Performance analysis of vertical and horizontal transmitter array modules using short and long wavelength VCSELs for optical interconnects”, Ikechi Augustine Ukaegbu, Do-Won Kim, M. S. M. Shirazy, Tae-Woo Lee, Mu Hee Cho, and Hyo-Hoon Park, IEEE Transactions on Components Packaging and Manufacturing Technology, vol. 3, no. 5, pp. 740-748, May 2013.

[80] “Wideband receiver for a three-dimensional ranging LADAR system”, Trong-Hieu Ngo, Chung-Hwan Kim, Kwon Yong Joon, Jin Sin Ko, D.-B. Kim, and Hyo-Hoon Park, IEEE Trans. on Circuits and Systems I, vol. 60, no. 2, pp. 448-456, Feb. 2013.

[79] “10 Gbps transimpedance amplifier-receiver for optical Interconnects”, Jamshid Sangirov, Ikechi Augustine Ukaegbu, Tae-Woo Lee, Mu Hee Cho, and Hyo-Hoon Park, J. of the Optical Society of Korea, vol. 17, no. 1, pp. 44-49, Feb. 2013.

[78] “On-chip temperature compensation for optical transmitter modules”, J. Sangirov, T.-W. Park, I. A. Ukaegbu, T.-W. Lee, and H.-H. Park, IEE Electronics Letters, vol. 49, no. 3, pp. 202-204, Jan. 2013.

[77] “Dynamic and energy efficient optical receiver module for optical interconnects”, Jamshid Sangirov, Ikechi Augustine Ukaegbu, Nga T. H. Nguyen, Tae-Woo Lee, Mu Hee Cho, and Hyo-Hoon Park, SPIE Optical Engineering Journal, June 2012.

[76] “2×2 polymer thermo-optic digital optical switch using total-internal-reflection in bend-free waveguides”, Young-Tak Han, Jang-Uk Shin, Sang-Ho Park, Jun-Kyu Seo, Hyung-Jong Lee, Wol-Yon Hwang, Hyo-Hoon Park, and Yongsoon Baek, IEEE Photon. Tech. Lett., vol. 24, no. 19, pp. 1757-1760, Oct. 2012.

[75] “N×N polymer matrix switches using thermo-optic total-internal-reflection switch”, Young-Tak Han, Jang-Uk Shin, Sang-Ho Park, Hyung-Jong Lee, Wol-Yon Hwang, Hyo-Hoon Park, and Yongsoon Baek, Optics Express, vol.20, no.12, pp.13284-13295, June 2012.

[74] “A novel, low-complexity, high-speed envelope detector and its applications”, Trong-Hieu Ngo, Tae-Woo Lee, and Hyo-Hoon Park, International Journal of Circuit Theory and Applications, vol.40, no.6, pp.627-634, June 2012.

[73] “Small area and high inductance semi-stacked spiral inductor with high Q factor”, Ikechi Augustine Ukaegbu, Kwang-Seong Choi, Olim Hidayov, Jamshid Sangirov, Tae-Woo Lee, and Hyo-Hoon Park, IET Microwaves, Antennas and Propagation Journal, vol.6, no.8, pp.13284-13295, June 2012.

[72] “Signal synchronization using flicker reduction and de-noising algorithm for video-signal optical interconnect”, Jamshid Sangirov, Ikechi Augustine Ukaegbu, Tae-Woo Lee, Mu Hee Cho, and Hyo-Hoon Park, ETRI Journal, vol.34, no.1, pp.122-125, Feb. 2012.

[71] “2.5 Gb/s/ch long wavelength transmitter modules for chip-to-chip optical PCB applications”, Augustine I. Ukaegbu, D.-W. Kim, M. H. Cho, T.-W. Lee, and Hyo-Hoon Park, IEEE Photon. Tech. Lett., vol.23, no.19, pp.1403-1405, Oct. 2011.

[70] “Analytical model for crosstalk analysis of optoelectronic transmitter modules for optical interconnects”, Augustine I. Ukaegbu, J. Sangirov, M. H. Cho, T.-W. Lee, and Hyo-Hoon Park, SPIE Optical Engineering, vol.50, no.7, pp.075401/1-075401/8, July 2011.

[69] “Polymer 1×2 thermo-optic digital optical switch based on the total-internal-reflection effect”, Young-Tak Han, Jang-Uk Shin, Sang-Ho Park, Sang-Pil Han, Yongsoon Baek, Chul-Hee Lee, Young-Ouk Noh, and Hyo-Hoon Park, ETRI Journal, vol.33, no.2, pp.275-278, Apr. 2011.

[68] “4.1mW 50dBΩ 10Gbps transimpedance amplifier for optical receivers in 0.13m CMOS”, Trong-Hieu Ngo, Tae-Woo Lee, and Hyo-Hoon Park, Microwave and Optical Technology Letters, vol.53, no.2, pp.448-451, Feb. 2011.

[67] “Optical chip-to-chip link system by using optical wiring methods for reducing EMI”, In-Kui Cho, Jae-Hoon Yun, Myung-Yung Jeong, and Hyo-Hoon Park, IEEE Trans. on Advanced Packaging, vol.33, no.3, pp.722-728, Aug. 2010.

[66] “Fabrication of 10-channel polymer thermo-optic digital optical switch array”, Young-Tak Han, Jang-Uk Shin, Sang-Ho Park, Sang-Pil Han, Yongsoon Baek, Chul-Hee Lee, Young-Ouk Noh, Hyung-Jong Lee, and Hyo-Hoon Park, IEEE Photon. Tech. Lett, vol.21, no.20, pp.1556-58, Oct. 2009.

[65] “Bidirectional CMOS transceiver with automatic mode control for chip-to-chip optical interconnects”, Trong-Hieu Ngo, Nga T. H. Nguyen, Tae-Woo Lee, and Hyo-Hoon Park, IEEE Photon. Tech. Lett., vol.21 , no.17, pp.1241-1243, Sept. 2009.

[64] “Fabrication of thermally stable and cost-effective polymeric waveguide for optical printed-circuit board”, Do-Won Kim, Seung Ho Ahn, In-Kui Cho, Dong-Min Im, Shirazy Md. Shorab Muslim, and Hyo-Hoon Park, Optics Express, vol.16, no.21, pp.16798-16805, Oct. 2008.

[63] “Optical interconnection platform composed of fiber-embedded board, 90°-bent fiber block and 10 Gb/s optical module”, Sung Hwan Hwang, Mu Hee Cho, Sae-Kyoung Kang, Han Seo Cho, Tae-Woo Lee, and Hyo-Hoon Park, IEEE J. of Lightwave Technology, vol.26, no.11, pp.1479-1485, June 2008.

[62] “Optical module using polymer waveguide with integrated reflector mirrors”, In-Kui Cho, Woo-Jin Lee, Myung-Yung Jeong, and Hyo-Hoon Park, IEEE Photonics Technology Letters, vol.20, no.6, pp.410-412, March 2008.

[61] “Improving 60-GHz band radio-frequency with radio-over-fiber link characteristics of optical transmitter system-on-packaging”, Kwang-Seong Choi, Yong-Duck Chung, Jae-Sik Sim, Jong-Tae Moon, Hyun-Kyu Yu, Hyo-Hoon Park, and Jeha Kim, SPIE Optical Engineering, vol.47, no.2, pp.025005(1)-(6), Feb. 2008.

[60] “System-on-packaging with electro-absorption modulator for a 60-GHz band radio-over-fiber link”, Kwang-Seong Choi, Yong-Duck Chung, Dong-Suk Jun, Jong-Tae Moon, Jeha Kim, Hyun-Kyu Yu, and Hyo-Hoon Park, IEEE Transactions on Advanced Packaging, vol.31, no.1, pp.163-169, Feb. 2008.

[59] “High-efficiency and stable optical transmitter using VCSEL-direct-bonded connector for optical interconnection”, Do-Won Kim, Tae-Woo Lee, Mu Hee Cho, and Hyo-Hoon Park, Optics Express, vol.15, no.24, pp.15767-15775, Nov. 2007.

[58] “Chip-to-chip optical link system using an optical wiring method”, In-Kui Cho, Seung Ho Ahn, Byung Sup Rho, Kyo Seung Chung, Hyo-Hoon Park, IEEE Photonics Technology Letters, vol.19, no.15, pp.1151-1153, Aug. 2007.

[57] “Two-dimensional optical interconnection based on two-layered optical printed circuit board”, Sung Hwan Hwang, Mu Hee Cho, Sae-Kyoung Kang, Tae-Woo Lee, Hyo-Hoon Park, and Byung Sup Rho, IEEE Photonics Technology Letters, vol.19, no.6, pp. 411- 413, March 2007.

[56] “Flip-chip bonding of MEMS scanner for laser display using electroplated AuSn solder bump”, Kun-Mo Chu, Won-Kyoung Choi, Young-Chul Ko, Jin-Ho Lee, Hyo-Hoon Park, and Duk Young Jeon, IEEE Trans. on Advanced Packaging, vol.30, no.1, pp.27-33, Feb. 2007.

[55] “High-speed subcarrier based on high-resistivity silicon for long-wavelength VCSEL array”, Sung Hwan Hwang, Hyo-Hoon Park, Jung-Hwan Choi, and Byung Sup Rho, IEEE Photonics Technology Letters, vol.18, no.23, pp.2523-2525, Dec. 2006.

[54] “Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications”, Kun-Mo Chu, Jung-Hwan Choi, Jung-Sub Lee, Han Seo Cho, Seong-Ook Park, Hyo-Hoon Park, and Duk Young Jeon, IEEE Trans. on Advanced Packaging, vol.29, no.3, pp.409-414, Aug. 2006.

[53] “Parallel optical transmitter module using angled fibers and a V-grooved silicon optical bench for VCSEL array”, Sung Hwan Hwang, Dae Dong Seo, Jae Yong An, Myeong-Hyun Kim, Woo Chang Choi, Sung Ryul Cho, Sang Hwan Lee, Hyo-Hoon Park, and Han Seo Cho, IEEE Trans. on Advanced Packaging, vol.29, no.3, pp.457-462, Aug. 2006.

[52] “Multigigabit CMOS limiting amplifier and VCSEL driver arrays for parallel optical interconnects”, Sae-Kyoung, Kang, Tae-Woo Lee, and Hyo-Hoon Park, Microwave and Optical Technology Letters, vol.48, no.8, pp.1656-1659, Aug. 2006.

[51] “Multichip optical transmitter module for chip-to-chip interconnection on optical PCBs”, Sae-Kyoung Kang, Tae-Woo Lee, Sung Hwan Hwang, Mu Hee Cho, and Hyo-Hoon Park, IEE Electronics Letters, vol. 42, no.14, pp.805-806, July 2006.

[50] “2.5 Gbit/s multifunctional CMOS transceiver for chip-to-chip optical link”, Sae-Kyoung Kang, Tae-Woo Lee, and Hyo-Hoon Park, IEE Electronics Letters, vol.42, no.7, pp.410-412, March 2006.

[49] “Passively assembled optical interconnection system based on an optical printed-circuit board”, Sung Hwan Hwang, Mu Hee Cho, Sae-Kyoung Kang, Hyo-Hoon Park, Han Seo Cho, Sang-Hoon Kim, Kyoung-Up Shin, and Sang-Won Ha, IEEE Photonics Technology Letters, vol.18, no.5, pp.652-654, March 2006.

[48] “A novel bidirectional CMOS transceiver for chip-to-chip optical interconnects”, Sae-Kyoung Kang, Tae-Woo Lee, and D. V. Plant, Hyo-Hoon Park, IEEE Photonics Technology Letters, vol.18, no.1, pp.70-72, Jan. 2006.

[47] “Low-crosstalk 10-Gb/s flip-chip array module for parallel optical interconnects”, Sang Hyun Park, Sung Min Park, Hyo-Hoon Park, and Chul Soon Park, IEEE Photonics Technology Letters, vol.17, no.7, pp.1516-1518, July 2005.

[46] “Experimental demonstration of 10 Gbit/s transmission with an optical backplane system using optical slots”, In-Kui Cho, K. B. Yoon, Seung Ho Ahn, H. -K. Sung, Sang-Won Ha, Y. U. Heo, and Hyo-Hoon Park, Optics Letters, vol.30, no.13, pp.1635-1637, July 2005.

[45] “High-coupling-efficiency optical interconnection using a 90°-bent fiber array connector in optical printed circuit boards”, Mu Hee Cho, Sung Hwan Hwang, Han Seo Cho, and Hyo-Hoon Park, IEEE Photonics Technology Letters, vol.17, no.3, pp.690-692, March 2005.

[44] “Compact packaging of optical and electronic components for on-board optical interconnects”, Han Seo Cho, Kun Mo Chu, Saekyoung Kang, Sung Hwan Hwang, Byung Sup Rho, Weon Hyo Kim, Joon-Sung Kim, Jang-Joo Kim, and Hyo-Hoon Park, IEEE Trans. on Advanced Packaging, vol.28, no.1, pp.114-120, Feb. 2005.

[43] “VCSEL array module using (111) facet mirrors of a V-Grooved silicon optical bench and angled Fibers”, Sung Hwan Hwang, Jae Yong An, Myeong-Hyun Kim, Woo Chang Choi, Sung Ryul Cho, Sang Hwan Lee, Han Seo Cho, and Hyo-Hoon Park, IEEE Photonics Technology Letters, vol.17, no.2, pp.477-479, Feb. 2005.

[42] “Fabrication of fiber-embedded boards using grooving technique for optical interconnection application”, Han Seo Cho, Saekyoung Kang, Byung Sup Rho, Hyo-Hoon Park, Kyoung-Up Shin, Sang-Won Ha, and Byoung-Ho Rhee, Dong-Su Kim, Sun Tae Jung, and Taeil Kim, SPIE Optical Engineering, vol.43, no.12, pp.3083-3088, Dec. 2004.

[41] “Optoelectronic and microwave characteristics of silver coated indium bump for low temperature flip-chip applications”, Kun-Mo Chu, Jung-Hwan Choi, Jung-Sub Lee, Han Seo Cho, Seong-Ook Park, Hyo-Hoon Park, and Duk Young Jeon, IEE Electronics Letters, vol.40, no.23, pp.1508-1509, Nov. 2004.

[40] “A simple method for calculating coupling efficiency in optical interconnection system involving various misalignment parameters”, Han Seo Cho, Weon Hyo Kim, and Hyo-Hoon Park, Optics and Lasers in Engineering, vol.42, pp.503-509, Nov. 2004.

[39] “A fluxless flip chip bonding for VCSEL arrays using silver coated indium solder bumps”, Kun-Mo Chu, Jung-Sub. Lee, Han Seo Cho, Hyo-Hoon Park, and Duk Young Jeon, IEEE Trans. on Electronics Packaging and Manufacturing, vol.27, no.4, pp.246-253, Oct. 2004.

[38] “PCB-compatible optical interconnection using 45°-ended connection rods and via-holed waveguides”, Byung Sup Rho, Han Seo Cho, Saekyoung Kang, Hyo-Hoon Park, Sang-Won Ha, and Byoung-Ho Lee, IEEE J. of Lightwave Technology, vol.22, no.9, pp.2128-2134, Sept. 2004.

[37] “Optical backplane system using waveguide-embedded PCBs and metal optical slots”, Keun Byoung Yoon, In-Kui Cho, Seung Ho Ahn, Myung Yong Jeong, Deug Ju Lee, Young Un Heo, Byung Sup Rho, Hyo-Hoon Park, and Byoung-Ho Rhee, IEEE J. of Lightwave Technology, vol.22, no.9, pp.2119-21274, Sept. 2004.

[36] “Characteristics of indium bump for flip-chip bonding used in polymeric-waveguide- integrated optical interconnection systems”, Kun-Mo Chu, Jung-Sub Lee, Han Seo Cho, Byung Sup Rho, Hyo-Hoon Park, and Duk Yung Jeon, Japanese J. of Applied Physics, vol.43, no.8B, pp.5922-5927, Aug. 2004.

[35] “Board-to-board optical interconnection system using optical slots”, In-Kui Cho, Keun Byoung Yoon, Seung Ho Ahn, Myung Yong Jeong, Hee-Kyung Sung, Byoung-Ho Lee, Young Un Heo, and Hyo-Hoon Park, IEEE Photonics Technology Letters, vol.16, no.7, pp.1754-1756, July 2004.

[34] “Optical interconnection using fiber-embedded boards and connection blocks fabricated by micro-grooving technique for fiber insertion”, Han Seo Cho, Saekyoung Kang, Byung Sup Rho, Hyo-Hoon Park, Kyoung-Up Shin, Sang-Won Ha and Byoung-Ho Rhee, Dong-Su Kim, Sun Tea Jung, and Taeil Kim, J. of Micromechanics and Microengineering, vol.14, pp.1181-1184, June 2004.

[33] “Low-crosstalk and high efficiency optical interconnection using 45°-ended connection rods”, Byung Sup Rho, Han Seo Cho, Saekyoung Kang, Hyo-Hoon Park, Sang-Won Ha, and Byoung-Ho Rhee, IEE Electronics Letters, vol.40, no.12, pp.730-731, June 2004.

[32] “Semiconductor Lasers-Characteristics of Indium Bump for Flip-Chip Bonding Used in Polymeric-Waveguide-Integrated Optical Interconnection Systems”, Kun-Mo Chu, Jung-Sub Lee, Han Seo Cho, Byung Sup Rho, Hyo-Hoon Park, and Duk Young Jeon, Japanese J. of Applied Physics-Part 1, vol.43, no.8, pp.5922-5927, 2004.

[31] “Thermal and chemical stability of reflowed-photoresist microlenses”, Myung-Geun Han, Yoon-Jung Park, Seoung-Hoe Kim, Byueng-Su Yoo, and Hyo-Hoon Park, J. of Micromechanics and Microengineering, vol.15, pp.398-402, Dec. 2003.

[30] “New pump wavelength of 1540nm-band for long-wavelength-band erbium-doped fiber amplifier (L-band EDFA)”, Bo-Hun Choi, Hyo-Hoon Park, Moo-Jung Chu, and Jong-Hyun Lee, IEEE J. of Quantum Electronics, vol.39, no.10, pp.1272-1280, Oct. 2003.

[29] “Comparison of 1545nm pump to 1480nm pump for high power long-wavelength-band erbium-doped fiber amplifier”, Bo-Hun Choi, Hyo-Hoon Park, and Moo-Jung Chu, IEE Electronics Letters, vol.39, no.13, pp.970-972, June 2003.

[28] “High-gain coefficient long-wavelength-band Erbium-doped fiber amplifier using 1530nm band pump”, Bo-Hun Choi, Hyo-Hoon Park, Moo-Jung Chu, and Seung Kwan Kim, IEEE Photonics Technology Letters, vol.13, no.2, pp.109-111, Feb. 2001.

[27] “Performance of erbium-doped fiber amplifier using 1530m-band pump for long wavelength multichannel amplification”, Bo-Hun Choi, Moo-Jung Chu, Hyo-Hoon Park, and J.-H. Lee, ETRI Journal, vol.23, no.1, pp.1-8, March 2001.

[26] “Polarization control of vertical-cavity surface-emitting lasers by electro-optic birefringence”, M. S. Park, B. T. Ahn, B.-S. Yoo, H. Y. Chu, Hyo-Hoon Park, and C. J. Chang-Hasnain, Applied Physics Letters, vol.76, no.7, pp.813-815, Feb. 2001.

[25] “High-finesse AlxOy/AlGaAs nonabsorbing optical cavity”, H. E. Shin, Y. G. Ju, H. W. Song, I. Y. Han, J. H. Ser, H. Y. Ryu, Y. H. Lee, and Hyo-Hoon Park, Applied Physics Letters, vol.72, no.18, pp.2205-2207, May 1998.

[24] “Polarization properties of vertical-cavity surface-emitting lasers with various patterns in tilted pillar structures”, Min Soo Park, Byung Tae Ahn, Hye Yong Chu, Byueng-Su Yoo, and Hyo-Hoon Park, Japanese J. Applied Physics, vol.37, pp.6295-6300, 1998.

[23] “Transverse mode characteristics of vertical-cavity surface-emitting lasers buried in amorphous GaAs antiguiding layer”, Byueng-Su Yoo, Hye Yong Chu, Hyo-Hoon Park, Hae Gwon Lee, and Jaejin Lee, IEEE J. Quantum Electronics, vol.33, no.10, pp.1794-1800, Oct. 1997.

[22] “Polarization characteristics of index-guided surface-emitting lasers with tilted pillar structure”, Hye Yong Chu, Byueng-Su Yoo, Min Soo Park, and Hyo-Hoon Park, IEEE Photonics Technology Letters, vol.9, no.8, pp.1066-1068, Aug. 1997.

[21] “Hydrogen passivated vertical-cavity surface-emitting lasers”, Byueng-Su Yoo, Hye Yong, Chu, and Hyo-Hoon Park, J. of Korean Physics Society, vol.30 (Suppl. Part 1), pp.S73-S76, 1997.

[20] “Stable transverse mode emission in vertical-cavity surface-emitting lasers antiguided by amorphous GaAs layer”, Byueng-Su Yoo, Hye Yong, Chu, Min Soo Park, Hyo-Hoon Park, and El-Hang Lee, IEE Electronics Letters, vol.32, no.4, pp.116-117, Jan. 1996.

[19] “Amorphous GaAs passivation of ion-beam-etched InGaAs vertical-cavity surface-emitting laser”, Hyo-Hoon Park, Byueng-Su Yoo, Min Soo Park, Hye Yong Chu, Jaejin Lee, Hae Gwon Lee, El-Hang Lee, Jae-Heon Shin, and Y. H. Lee, J. of Korean Physical Society, vol.29, pp.522-525, Aug. 1996.

[18] “Low threshold current and single-mode surface-emitting laser buried in amorphous GaAs”, Hyo-Hoon Park, Byueng-Su Yoo, Hye Yong Chu, El-Hang Lee, Min Soo Park, and Byung Tae Ahn, Japanese J. of Applied Physics, part1, vol.35, no.213, pp.1378-1381, Feb. 1996.

[17] “Evolution of the surface cross-hatch pattern in InGaAs/GaAs layers grown by metal-organic chemical vapor deposition”, Meeyoung Yoon, Bun Lee, Jong-Hyeob Baek, Hyo-Hoon Park, El-Hang Lee, and Jeong Yong Lee, Applied Physics Letters, vol.68, pp.16-18, Jan. 1996.

[16] “Surface morphology of InGaAs (100) by chemical beam epitaxy using unprecracked monoethylarsine, triethylgallium and triethylindium”, S.-J. Park, J.-R. Ro, J.-S. Ha, S.-B.Kim, H.-H. Park, E.-H. Lee, J.-Y. Yi, and J. Y. Lee, Surface Science, vol. 350, pp.221-228, Nov. 1995.

[15] “Precise nonselective chemically-assisted ion-beam etching of AlGaAs/GaAs Bragg reflectors by in-situ laser reflectometry”, J. Y. Yoon, J. H. Shin, Y. H. Lee, H.-H. Park, and B.-S. Yoo, Optical and Quantum Electronics, vol. 27, pp.421-425, May 1995.

[14] “Low threshold current density and high efficiency surface-emitting lasers with a periodic gain active structure”, Hyo-Hoon Park and Byueng-Su Yoo, ETRI Journal, vol.17, no.1, pp.1-10, April 1995.

[13] “Low threshold current density InGaAs surface-emitting lasers with a periodic gain active structure”, Byueng-Su Yoo, Hyo-Hoon Park, and El-Hang Lee, IEE Electronics Letters, vol.30, no.13, pp.1060-1061, June 1994.

[12] “Homogeneous nucleation of misfit dislocations in strained layers”, Hyo-Hoon Park and Jeong Yong Lee, Japanese J. of Applied Physics, part 1, vol.33, no.6A, pp.164-169, June 1994.

[11] “Effect of stress sign and film thickness on interface nucleation of misfit dislocations in strained multilayers”, Hyo-Hoon Park, Ji Beom Yoo, Dae Kon Oh, Jeong Soo Kim, and Jeong Yong Lee, J. of Applied Physics, vol.75, no.10, pp.4990-4993, May 1994.

[10] “Microstructural degradation during Zn diffusion in a GaInAsP/InP heterostructure: Layer mixing, misfit dislocation generation, and Zn3P2 precipitation”, Hyo-Hoon Park, Kyung Ho Lee, Jung Kee Lee, Yong Tak Lee, El-Hang Lee, Jeong Yong Lee, Soon-Ku Hong , and O’Dae Kwon, J. of Applied Physics, vol.72, no.9, pp.4063-4072, Nov. 1992.

[9] “Formation of misfit dislocations during Zn-diffusion-induced intermixing of a GaInAsP/InP heterostructure”, Hyo-Hoon Park, Eun Soo Nam, Yong Tak Lee, El-Hang Lee, and Jeong Yong Lee , Applied Physics Letters, vol.59, no.16, pp.2025-2027, Oct. 1991.

[8] “Zn diffusion enhancement of interdiffusion in a GaInAsP-InP heterostructure”, Hyo-Hoon Park, Bong Ku Kang, Eun Soo Nam, Yong Tak Lee, Jung Ho Kim, and O’Dae Kwon, Applied Physics Letters, vol.55, no.17, pp.1768-1770, Oct. 1989.

[7] “Impurity diffusion enhancement of interdiffusion in GaInAsP heterostructures lattice-matched to GaAs and InP”, Hyo-Hoon Park, Kyung Ho Lee, Eun Soo Nam, Yong Tak Lee, Jung Ho Kim, Bong Ku Kang, and O’Dae Kwon, J. of Korean Physical Society, vol.22, no.4, pp.435-443, Dec. 1989.

[6] “Impurity diffusion enhancement of interdiffusion in an InGaAsP-GaAs heterostructure”, Kyung Ho Lee, Hyo-Hoon Park and D. A. Stevenson, J. of Applied Physics, vol.66, no.3, pp.1048-1052, Feb. 1989.

[5] “Zn diffusion enhancement of interdiffusion in a GaAs-InGaPAs heterostructure”, Hyo-Hoon Park, Kyung Ho Lee, and D. A. Stevenson, Applied Physics Letters, vol.53, no.23, pp.2299-2301, Dec. 1988.

[4] “The critical grain size for liquid flow into pores during liquid phase sintering”, Hyo-Hoon Park, Oh-Jong Kwon, and Duk N. Yoon, Metallugical Transactions A, vol.17A, pp.1915-1919, Nov. 1986.

[3] “An analysis of the surface menisci in a mixture of liquid and deformable grains”, Hyo-Hoon Park, Suk-Joong L. Kang, and Duk N. Yoon, Metallugical Transactions A, vol.17A, pp.325-330, Feb. 1986.

[2] “Effect of dihedral angle on the morphology of grains in a matrix phase”, Hyo-Hoon Park and Duk N. Yoon, Metallugical Transactions A, vol.16A, pp.923-928, May 1985.

[1] “Pore filling process in liquid phase sintering”, Hyo-Hoon Park, Seong-Jai Cho, and Duk. N. Yoon, Metallugical Transactions A, vol.15A, pp.1075-1080, June 1984.